The growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND flash technology. With planar NAND nearing its practical scaling limits, delivering to those requirements has become more difficult with each generation. Enter our 3D NAND technology, which uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability.
System designers who build products like laptops, mobile devices and servers can take advantage of 3D NAND’s unprecedented performance to meet the rising data movement needs for businesses and consumers.
If you're designing a next-generation mobile user experience, Micron's innovative 64-layer triple-level cell (TLC) 3D NAND technology solves the storage challenge.
Offering designers a basic understanding of the features and benefits of each type of NAND Flash in order to select the proper device.
Learn about 3D NAND, which offers 3X the capacity of existing planar NAND technologies, providing better performance and reliability.
