多晶片封裝

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

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Product Family
先進解決方案
DRAM
DRAM 模組
繪圖記憶體
管理型 NAND
記憶卡
多晶片封裝
NAND 快閃記憶體
NOR 快閃記憶體
固態硬碟
Product Technology
1100
1300
2200
3D NAND 快閃記憶體
5100
5200
5210
5300
7300
9200
9300
Authenta
Client SSD
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
DDR4 SDRAM
e.MMC
e.MMC for Automotive
e.MMC-Based MCP
嵌入式 USB
Enterprise MLC
Enterprise SSD
FortisFlash
GDDR5
GDDR5X
GDDR6
工業 microSD 卡
Industrial SSD
Legacy NOR Flash
LPDRAM
LRDIMM
Mini-DIMM
MLC NAND Flash
MT25Q
NAND-Based MCP
NOR Flash for Automotive
NOR-Based MCP
NVDIMM
NVMe SSD
平行式 NOR 快閃記憶體
RDIMM
RLDRAM
SATA SSD
SDRAM
Secure NOR Flash
Serial NAND Flash
序列式 NOR 快閃記憶體
SLC NAND Flash
SODIMM
固態硬碟
SORDIMM
TLC NAND Flash
Twin-Quad NOR 快閃記憶體
UDIMM
通用快閃記憶體儲存
VLP Mini-DIMM
VLP RDIMM
VLP UDIMM
Wafer Level CSP and KGD NOR Flash
Xccela 快閃記憶體
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By Family

e.MMC-Based MCP
Quick look
  • Embedded managed NAND and High Performance LPDRAM in a single package
  • Simplified software solutions for complex high density NAND applications
  • 技術
    e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
  • 封裝
    WFBGA, VFBGA, TFBGA, POP
UFS-Based MCP (uMCP)
Quick look
  • Embedded managed NAND and high-performance LPDRAM in a single package.
  • Enables high-density, low-power storage in a small footprint.
  • 技術
    LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
  • Densities
    UFS: 32GB; LPDRAM: 24Gb (3GB)
  • 封裝
    WFBGA
NAND-Based MCP
Quick look
  • Offers high densities for data-intensive applications
  • Provides high speeds, with x8, x16 and x32 bus widths
  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
  • 技術
    LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    NAND: 1Gb - 8Gb
  • 封裝
    WFBGA, VFBGA, TFBGA, POP
NOR-Based MCP
Quick look
  • Simplifies design while speeding performance for low-density applications
  • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
  • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
  • Supports low-voltage applications (1.8V)
  • NOR Densities
    32Mb - 512Mb
  • Voltage
    1.8V
  • 封裝
    TFBGA, VFBGA
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