MTFC64GAPALBH-AIT

Orderable parts

MTFC64GAPALBH-AIT

Specs

  • Chipset Validation
    不適用
  • 容量
    64GB
  • FBGA 編號
    JWC72
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • Width
    x8

資料表

e.MMC 8–128GB v5.1 Automotive Data Sheet

MTFC8GAMALBH-AIT, MTFC8GAMALBH-AAT, MTFC8GAMALNA-AIT, MTFC8GAMALNA-AAT, MTFC16GAPALBH-AIT, MTFC16GAPALBH-AAT, MTFC16GAPALNA-AIT, MTFC16GAPALNA-AAT, MTFC32GAPALBH-AIT, MTFC32GAPALBH-AAT, MTFC32GAPALNA-AIT, MTFC32GAPALNA-AAT, MTFC64GAPALBH-AIT, MTFC64GAPALBH-AAT, MTFC64GAPALNA-AIT, MTFC64GAPALNA-AAT, MTFC128GAPALNS-AIT, MTFC128GAPALNS-AAT, MTFC128GAPALNA-AIT, MTFC128GAPALNA-AAT
  • File Type: PDF
  • Updated: 2020-11-25

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

IBIS embedded IT eMMC 5.1 (PS8226) - rev 1.8

MTFC8GAMALBH-AIT, MTFC8GAMALNA-AIT, MTFC16GAPALBH-AIT, MTFC16GAPALNA-AIT, MTFC32GAPALBH-AIT, MTFC32GAPALNA-AIT, MTFC64GAPALBH-AIT, MTFC64GAPALNA-AIT, MTFC128GAPALNS-AIT, MTFC128GAPALNA-AIT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: ZIP
  • Updated: 2020-05-12

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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