MT29F8G08ABACAWP-IT

Orderable parts

MT29F8G08ABACAWP-IT:C

Specs

  • Chipset Validation
    不適用
  • 容量
    8Gb
  • FBGA 編號
    不適用
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • 產品長期供貨計畫
    Yes
  • Product Longevity Program Start Date
    5/4/2011
  • Width
    x8

資料表

8Gb, 16Gb, x8, x16 M71M NAND Flash Memory Data Sheet

Data Sheet Rev O; Design Rev C
  • File Type: PDF
  • Updated: 2018-02-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HSpice: 8Gb,16Gb: x8, x16 NAND (Rev C) M71M

Rev. 2.0
  • File Type: ZIP
  • Updated: 2011-09-22

IBIS: 8Gb,16Gb: x8, x16 NAND (Rev C) M71M

Rev. 2.0
  • File Type: ZIP
  • Updated: 2012-05-29

Verilog: NAND 8/16Gb SLC M71M

8/16Gb Verilog model Rev 7.30
  • File Type: ZIP
  • Updated: 2012-08-21

技術說明文件

TN-29-68: One-Time Programmable Operations in 2Gb: x8, x16 NAND Flash Memory

This technical note describes one-time programmable operations in Micron's 2Gb: x8, x16 NAND Flash memory devices.
  • File Type: PDF
  • Updated: 2016-08-16

TN-29-52: Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm

This technical note provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A)
  • File Type: PDF
  • Updated: 2015-09-22
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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