MT41K1G8RKB-107

Orderable parts

MT41K1G8RKB-107:N

Specs

  • Chipset Validation
    不適用
  • Data Rate
    DDR3-1866
  • 容量
    8Gb
  • FBGA 編號
    D9SXR
  • Features
  • Op. Temp.
    0C to +95C
  • Part Status
    Obsolete
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • Width
    x8

資料表

8Gb: x4, x8 TwinDie DDR3L SDRAM

Rev. K
  • File Type: PDF
  • Updated: 2018-08-02

Simulation Models

HSPICE: 8Gb TwinDie DDR3/DDR3L SDRAM

1.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2018-05-07

IBIS: 8Gb TwinDie DDR3/DDR3L SDRAM

1.0 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2018-05-07

IBIS: 8Gb TwinDie DDR3/DDR3L SDRAM

2.0 (Die Rev. N)
  • File Type: ZIP
  • Updated: 2015-10-06

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
查看全部

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
查看全部
+
Powered by Translations.com GlobalLink OneLink SoftwarePowered By OneLink