MT41K128M8DA-107 AIT

Orderable parts

MT41K128M8DA-107 AIT:J


  • Chipset Validation
  • Data Rate
  • Density
  • FBGA Code
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Width

Data Sheets

1Gb: x8, x16 Automotive DDR3L SDRAM

MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-05-20

Simulation Models


Version 2.3 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2016-09-12


Version 2.1 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2018-08-30

DDR3 SDRAM Verilog Model

  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

Bypass Capacitor Selection for High-Speed Designs

Describes bypass capacitor selection for high-speed designs.
  • File Type: PDF
  • Updated: 2011-03-23

TN-00-20: Understanding Signal Integrity

Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
  • File Type: PDF
  • Updated: 2009-12-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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