UFS 3.1 Client Storage

The Micron UFS 3.1 client storage device delivers industry-leading storage densities1 to enable flexible OEM designs that provide an optimal user experience for value-focused client platforms.

優勢

Facilitates exceptional battery life

The Micron UFS 3.1 devices require up to 83% less power during active use2 and 93% less power during sleep mode3 than other client SSD form factors. Power savings mean performance and extended battery life without thermal throttling.

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Promotes creative PC designs that meet a diverse set of use cases

Unlike SSDs with M.2 form factors, there is no socket necessary for the Micron UFS. Its thin 0.8mm z-height and 11.0x13.0mm profile provides 78% more PCB area than the smallest M.2 SSDs.4 The Micron UFS profile frees up space for more design flexibility in client devices.

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Provides significantly higher performance than the e.MMC 5.1 standard

The Micron UFS 3.1 device Command Queue technology enables read and write commands simultaneously, resulting in random reads that are four times faster than e.MMC and sequential writes that are four to six times faster than e.MMC.5 With write speeds up to 1890MB/s, its performance helps prevent buffering when downloading files.

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1 Based on a survey of public material at the time of this document’s publication.
2 The active-mode power consumption comparison: UFS –> VCCQ x ICCQ = 1.2V x 800mA = 960mW (max); 2450 M.2 SSD –> 5500mW (max); (5500 - 960)/5500 = 83%
3 The sleep-mode power consumption comparison: UFS –> VCC x ICC = 2.5V x 80µA = 0.200mW (max); 2450 M.2 SSD –> 3mW (max); (3 - 0.200)/3 = 93%
4 The "78% more PCB area" statement is due to a calculation based on the Micron UFS device's areal footprint of 143 mm2 calculated from its x and y dimensions found in the Micron UFS FS194/195/196 datasheet and comparing the same areal footprint of 660mm2 calculated from the x and y dimensions found in the M.2 22x30 specification. (See https://www.snia.org/forums/cmsi/knowledge/formfactors#M2 for M.2 22x30 dimensions). (660-143)/660 = 78%
5 Comparative random 4KB reads for e.MMC and UFS are 44KIOPS-53KIOPS and 180KIOPS-200KIOPS, respectively. Comparative sequential 512KB writes for e.MMC and UFS are 270MB/s and 1200MB/s-1890MB/s, respectively.

容量

Select Density
  • 32GB
  • 64GB
  • 128GB
  • 256GB
範圍:32GB - 256GB
  • 電壓
    3.3V
  • 封裝
    TFBGA
  • Protocol
    UFS 2.1
  • Op. Temp.
    -45C to +95C, -45C to +105C
  • 電壓
    3.3V
  • 封裝
    TFBGA
  • Protocol
    UFS 2.1
  • Op. Temp.
    -45C to +95C, -45C to +105C
  • 電壓
    3.3V
  • 封裝
    TFBGA
  • Protocol
    UFS 2.1
  • Op. Temp.
    -45C to +95C, -45C to +105C
  • 電壓
    3.3V
  • 封裝
    TFBGA
  • Protocol
    UFS 2.1
  • Op. Temp.
    -45C to +95C, -45C to +105C
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