Orderable parts



  • Block Config
    High Lock
  • Chipset Validation
  • Density
  • FBGA Code
  • Op. Temp.
    -40C to +85C
  • Part Family
  • Part Status
  • Product Longevity Program
  • Product Longevity Program Start Date
  • Width

Data Sheets

1Gb, x8/x16, 3V, MT28EW Embedded Parallel NOR Data Sheet

  • File Type: PDF
  • Updated: 2018-05-10


China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 9/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 9/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 9/1/2023

Simulation Models


I/O ranges supported= 1.65–1.95V, 2.7–3.6V. PP (packages)= JS, PC. TT (temp range)= IT, AT.
  • File Type: ZIP
  • Updated: 2016-11-11

Verilog_MT28EW_1Gbit_High lock, Rev 1

Verilog: MT28EW01GABA1Hpp-1xtt
  • File Type: GZ
  • Updated: 2017-08-08

Technical Notes

TN-1335: Migrating S29GL-N/P to MT28EW NOR Flash Devices

  • File Type: PDF
  • Updated: 2015-09-23

TN-13-37: Migrating from Micron M29EW Devices to MT28EW NOR Flash Devices

This technical note describes the process for converting a system design from the Micron M29EW devices to MT28EW single-level cell NOR Flash devices, including 128Mb, 256Mb, 512Mb, and 1Gb densities. PCN's 32162, 32163
  • File Type: PDF
  • Updated: 2014-09-10

TN-13-36: Migrating from S29GL-S Device to MT28EW NOR Flash Devices

This technical note describes the process for converting a system design from the Spansion S29GL-S device to the Micron MT28EW single-level cell 45nm NOR Flash device, including 128Mb, 256Mb, 512Mb, and 1Gb densities.
  • File Type: PDF
  • Updated: 2014-09-02
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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