Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
TN-13-37: Migrating from Micron M29EW Devices to MT28EW NOR Flash Devices
This technical note describes the process for converting a system design from the Micron M29EW devices to MT28EW single-level cell NOR Flash devices, including 128Mb, 256Mb, 512Mb, and 1Gb densities. PCN's 32162, 32163
TN-13-36: Migrating from S29GL-S Device to MT28EW NOR Flash Devices
This technical note describes the process for converting a system design from the Spansion S29GL-S device to the Micron MT28EW single-level cell 45nm NOR Flash device, including 128Mb, 256Mb, 512Mb, and 1Gb densities.
CSN-24: ESD Precautions for Die/Wafer Handling and Assembly
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
