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MT29F2G01ABBGDWB-IT

Orderable parts

MT29F2G01ABBGDWB-IT:G

Specs

  • Chipset Validation
    N/A
  • Density
    2Gb
  • FBGA Code
    NW875
  • Op. Temp.
    -40C to +85C
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x1

Data Sheets

2Gb 1.8V x1,x2,x4 SPI M79A NAND Flash Memory Data Sheet

M79A; SLC; MT29F2G01ABBGDSF, MT29F2G01ABBGDWB, MT29F2G01ABBGDWB-IT, MT29F2G01ABBGDWB-IT:G
  • File Type: PDF
  • Updated: 2022-10-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 2/1/2024

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 2/1/2024

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2024

Simulation Models

HSpice: 2Gb, 4Gb SPI M79A SLC NAND

Rev 2.0, MT29F2G01ABAGD12-AAT:G, MT29F2G01ABAGDSF-AAT:G, MT29F2G01ABAGD12-IT:G, MT29F2G01ABAGDSF-IT:G, MT29F2G01ABAGDWB-IT:G, MT29F2G01ABBGDSF-IT:G, MT29F2G01ABBGDWB-IT:G, MT29F4G01ADAGDSF-IT:G, MT29F4G01ADAGDWB-IT:G
  • File Type: ZIP
  • Updated: 2021-11-15

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-29-17: NAND Flash Design and Use Considerations

This technical note presents effective design and use practices to help avoid potential problems.
  • File Type: PDF
  • Updated: 2018-11-21

TN-29-58: ONFI NV-DDR2 Design Guide

This technical note explains the device features that enable NV-DDR2 and provides guidelines for system designs to enable I/O transfer rates of up to 400 MT/s using the NV-DDR2 interface.
  • File Type: PDF
  • Updated: 2016-09-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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