e.MMC-Based MCP

Our e.MMC-Based MCPs do more than meet the memory requirements of mid-tier phones, tablets, auto infotainment systems and smart watches. They save more than 40% space versus discrete memory—reducing the memory footprint, simplifying PCB design, and speeding time to market. Built on a foundation of Micron-manufactured e.MMC (MLC/TLC NAND + microcontroller) and LPDRAM, these JEDEC-compliant, footprint-compatible devices enable simple and flexible system design and certification.

DRAM Density

Select DRAM Density
  • 4Gb
  • 8Gb
  • 16Gb
  • 32Gb
Range: 4Gb - 32Gb
  • DRAM Type
    LPDDR2, LPDDR3
  • Width
    x8, x32
  • Voltage
    3.3V
  • 封裝
    VFBGA
  • Op. Temp.
    -25C to +85C
  • DRAM Type
    LPDDR3
  • Width
    x8, x32
  • Voltage
    3.3V
  • 封裝
    WFBGA
  • Op. Temp.
    -25C to +85C
  • DRAM Type
    LPDDR3
  • Width
    x8
  • Voltage
    3.3V
  • 封裝
    WFBGA
  • Op. Temp.
    -25C to +85C
  • DRAM Type
    LPDDR3, LPDDR4
  • Width
    x8
  • Voltage
    3.3V
  • 封裝
    VFBGA, WFBGA
  • Op. Temp.
    -25C to +85C
Quick Find
+
Powered by Translations.com GlobalLink OneLink SoftwarePowered By OneLink