MT53E256M32D2DS-046 AAT

Orderable parts

MT53E256M32D2DS-046 AAT:B

Specs

  • Chipset Validation
    不適用
  • Cycle Time
  • Data Rate
    DDR4-4166
  • 容量
    8Gb
  • FBGA 編號
    D9WQR
  • Op. Temp.
    -40C to +105C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • 技術
    LPDDR4
  • Width
    x32

資料表

Data Sheet: 200b: x32 Automotive LPDDR4/LPDDR4X SDRAM (Z00M)

MT53E256M16D1, MT53E256M32D2
  • File Type: PDF
  • Updated: 2020-10-27

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HSPICE: 4Gb LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B
  • File Type: ZIP
  • Updated: 2020-08-20

IBIS: 4Gb Mobile LPDDR4 Z00M

WT, UT, AT, IT, XT, Z00M Mobile LPDDR4 SDRAM, Die Rev. B, 366b 8DP, 200b SDP, 200b DDP, 376b QDP
  • File Type: ZIP
  • Updated: 2020-08-20

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-46-22: T69M (50nm) to T79M (4xnm) Transition Guide

Transition guide for migration from T69M to T79M
  • File Type: PDF
  • Updated: 2016-06-24
查看全部

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
查看全部
+
Powered by Translations.com GlobalLink OneLink SoftwarePowered By OneLink