MT53D1024M32D4DT-046 WT

Orderable parts

MT53D1024M32D4DT-046 WT:D

Specs

  • Chipset Validation
    不適用
  • Cycle Time
    0.46ns
  • Data Rate
    DDR4-4266
  • 容量
    32Gb
  • FBGA 編號
    D9WQG
  • Op. Temp.
    -25C to +85C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • 技術
    LPDDR4
  • Width
    x32

資料表

Production Data Sheet: 200b: x16/x32 LPDDR4/LPDDR4X SDRAM

MT53D512M16D1, MT53D512M32D2, MT53D1024M32D
  • File Type: PDF
  • Updated: 2020-03-10

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HSPICE: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-10-06

IBIS: 8Gb Mobile LPDDR4 Z11M

WT, UT, AT, IT, Z11M Mobile LPDDR4 SDRAM, Die Rev. D, 556b, 432b, 376b, 366b, 200b
  • File Type: ZIP
  • Updated: 2020-10-06

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-46-22: T69M (50nm) to T79M (4xnm) Transition Guide

Transition guide for migration from T69M to T79M
  • File Type: PDF
  • Updated: 2016-06-24
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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