MT40A2G8VA-062E

Orderable parts

MT40A2G8VA-062E:B

Specs

  • Chipset Validation
    不適用
  • 容量
    16Gb
  • FBGA 編號
    D9XPF
  • Op. Temp.
    0C to +95C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • Width
    x8

資料表

16Gb: x4, x8, x16 DDR4 SDRAM

16Gb: x4, x8, x16 DDR4 SDRAM
  • File Type: PDF
  • Updated: 2021-08-19

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

16Gb DDR4 Automotive HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 HSPICE: Z22A

Rev. 2.2 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2019-06-19

16Gb DDR4 Automotive IBIS: Z22A

Rev. 2.4.1 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2021-05-19

16Gb DDR4 IBIS: Z22A

Rev. 2.4 (Die Rev. B)
  • File Type: ZIP
  • Updated: 2021-05-07

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-40-41: Adding ECC With DDR4 x16 Components

Adding ECC With DDR4 x16 Components
  • File Type: PDF
  • Updated: 2018-08-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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