MT41K512M16VRN-107 IT

Orderable parts

MT41K512M16VRN-107 IT:P

Specs

  • Chipset Validation
    不適用
  • Data Rate
    DDR3-1866
  • 容量
    8Gb
  • FBGA 編號
    D9XLQ
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • Width
    x16

資料表

8Gb: x16 TwinDie DDR3L SDRAM

MT41K512M16 – 64 Meg x 16 x 8 Banks
  • File Type: PDF
  • Updated: 2020-04-17

8Gb: x16 TwinDie Automotive DDR3L SDRAM

MT41K512M16 – 64 Meg x 16 x 8 Banks
  • File Type: PDF
  • Updated: 2020-01-07

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

Simulation Models

HSPICE: 8Gb TwinDie x16 DDR3/DDR3L SDRAM

1.1 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2020-01-10

IBIS: 8Gb TwinDie x16 DDR3/DDR3L SDRAM

1.2 (Die Rev. P)
  • File Type: ZIP
  • Updated: 2020-07-24

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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