MT29F4G08ABAFAH4-IT

Orderable parts

MT29F4G08ABAFAH4-IT:F

Specs

  • Chipset Validation
    不適用
  • 容量
    4Gb
  • FBGA 編號
    NW943
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • Width
    x8

資料表

Data Sheet: 4Gb 3.3v x8 NAND Flash Memory

MT29F4G08ABAFAWP, MT29F4G08ABAFAH4
  • File Type: PDF
  • Updated: 2018-12-31

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

技術說明文件

TN-29-17: NAND Flash Design and Use Considerations

This technical note presents effective design and use practices to help avoid potential problems.
  • File Type: PDF
  • Updated: 2018-11-21

TN-29-58: ONFI NV-DDR2 Design Guide

This technical note explains the device features that enable NV-DDR2 and provides guidelines for system designs to enable I/O transfer rates of up to 400 MT/s using the NV-DDR2 interface.
  • File Type: PDF
  • Updated: 2016-09-29
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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