MTFDKBK512TGE-1BK1AAB

Orderable parts

MTFDKBK512TGE-1BK1AABYY

Specs

  • 容量
    512GB
  • Chipset Validation
    不適用
  • FBGA 編號
    不適用
  • 零件狀態
    生產
  • Product Line
    2550
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • 讀取

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2023

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 6/1/2023

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-47: 2100AI/AT PCIe Schematics Reference Design (Rev. E)

This document provides system design guidelines for PCI NVMe™ SSDs belonging to Micron's 2100AT/2100AI product family.
  • File Type: PDF
  • Updated: 2022-07-05

TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2021-04-23

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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