MTFDHBA256TDV-1AY15AB

Orderable parts

MTFDHBA256TDV-1AY15ABYY

Specs

  • Capacity
    256GB
  • Chipset Validation
    不適用
  • FBGA 編號
    不適用
  • Part Status
    Production
  • Product Line
    2300
  • 產品長期供貨計畫
    No
  • Product Longevity Program Start Date
    不適用
  • READ
    3300 MB/s
  • WRITE
    1400 MB/s

資料表

2300 PCIe NVMe SSD Data Sheet

MTFDHBA256TDV, MTFDHBA512TDV, MTFDHBA1T0TDV, MTFDHBA2T0TDV
  • File Type: PDF
  • Updated: 2020-05-21

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 12/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 12/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 12/1/2021

技術說明文件

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2021-11-16

TN-FD-15: P320h/P420m SSD Performance Optimization and Testing

This technical note describes how to optimize and test the performance of the Micron P320h and P420m SSDs.
  • File Type: PDF
  • Updated: 2014-04-07

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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