MTFDHAL15T3TDP-1AT1ZAB

Orderable parts

MTFDHAL15T3TDP-1AT1ZABYY

Specs

  • Capacity
    15.36TB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Line
    9300 PRO
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    3500 GB/s
  • WRITE
    3500 GB/s

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2023

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 6/1/2023

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 6/1/2023

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 6/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-50: 2100AI/AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AI/AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2021-04-23

TN-FD-15: P320h/P420m SSD Performance Optimization and Testing

This technical note describes how to optimize and test the performance of the Micron P320h and P420m SSDs.
  • File Type: PDF
  • Updated: 2014-04-07

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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